“The Resistance Welding Troubleshooting Tool is one of the top 3 systems I have encountered in my 40+ year career.” – Art Schuneman, Helgeson
Learn when you might choose one technology over the other in this blog piece: Nd:YAG for Fiber Laser Welding?
Use a picosecond laser for corrosion resistant black marking on stainless steel alloys: UDI marking, banding, part traceability
What's all the fuss about? Read about micromachining with a femtosecond laser in our blog.
What is it and what can you do with it?
Laser soldering and plastic welding; both possible with direct diode lasers
Read our blog piece Bringing Laser Technology In House: 6 Simple Steps to Success which outlines some of the pitfalls and how to avoid when moving from contract manufacturing.
How to design ring projections for hermetic sealing.
Configure your Glovebox here…
Flexible circuit design for hot bar reflow soldering
Check out these tips and tricks for successful setup of your micro tig welding application.
Laser or resistance technology? Which do you choose when it's critical to prevent external environmental conditions from penetrating the package?
Projection welding of Fasteners to Hot Stamped Boron Components
Tips for Improving Tab to Terminal Connections
Industry increasingly relies on sensors in both factories and products. New sensor technologies mean new product capabilities with improved performance and efficiency.
Innovative and efficient process utilizes a laser to strip polymer coating to expose metal conductor.
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High production rate + high yield = industrial process success. Understanding both the process requirements and production environment allows companies to optimize their production rates resulting in lower cost per part and higher profit.
Hot Bar Reflow Soldering Pulsed heat hot bar reflow soldering is a selective soldering process in which two solder plated parts are pressed together and heated to a temperature adequate to cause the solder to melt and flow, after which the parts are cooled to form a permanent electro-mechanical bond. Pulsed heated soldering differs from traditional soldering because the reflow of solder is accomplished using a heating element called a "thermode" which is quickly heated and then cooled down for each connection resulting in strong joints. Pressure is applied throughout the entire cycle resulting in precise positioning. It also makes the process suitable for parts that might otherwise disconnect during cool down. Hot bar reflow soldering is also a good choice for applications that require multiple
connections to be made simultaneously; up to 200 leads or wires can be connected in a single process cycle. Hot bar reflow soldering processes are reproducible, quantifiable, and traceable to quality standards such as ISO / NIST. Hot Bar reflow soldering is safe, highly operator-independent and easy to automate.
Heat seal bonding - also called ACF bonding - is the process of creating electrical conductive adhesive bonds between flexible and rigid circuit boards, glass panel displays and flex foils with very fine pitch (<30 micron). The essential characteristics of this process are heating and cooling of the adhesive under pressure.
Heatstaking is a method of joining two or more parts, where at least one is made out of plastic. The bond is made by partially de-forming the plastic part to fix the other. Heatstaking is the most efficient way to bond metal to plastic, and is commonly used in high volume/low cost applications in the automotive, telecom and appliance industries. The process works by heating the plastic to a temperature above the glass transition temperature via the use of super-heated air or a thermode, and then applying pressure in order to deform it and create the stake. The plastic is then cooled down again - under constant pressure - below the glass transition temperature, ensuring good fixation of the parts. This cooling can be done with compressed air if using a thermode, or with a cold, preformed tool if super-heated air is used.
AMADA WELD TECH offers a full line of reflow soldering power supplies, bonding heads for benchtop use or for integration or automation, thermodes, and both standard and custom systems for reflow soldering, heat seal bonding and heat staking.
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