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Learn when you might choose one technology over the other in this blog piece: Nd:YAG for Fiber Laser Welding?
Use a picosecond laser for corrosion resistant black marking on stainless steel alloys: UDI marking, banding, part traceability
What's all the fuss about? Read about micromachining with a femtosecond laser in our blog.
What is it and what can you do with it?
Laser soldering and plastic welding; both possible with direct diode lasers
Read our blog piece Bringing Laser Technology In House: 6 Simple Steps to Success which outlines some of the pitfalls and how to avoid when moving from contract manufacturing.
How to design ring projections for hermetic sealing.
Configure your Glovebox here
Flexible circuit design for hot bar reflow soldering
Check out these tips and tricks for successful setup of your micro tig welding application.
Laser or resistance technology? Which do you choose when it's critical to prevent external environmental conditions from penetrating the package?
Projection welding of Fasteners to Hot Stamped Boron Components
Laser Cleaning Metal Improves Battery Pack Reliability. Read the blog now.
Industry increasingly relies on sensors in both factories and products. New sensor technologies mean new product capabilities with improved performance and efficiency.
Fast, clean, efficient! Read the blog.
Dark marks that are resistant to bacterial growth, passivation, corrosion and autoclaving. Read more.
High production rate + high yield = industrial process success. Understanding both the process requirements and production environment allows companies to optimize their production rates resulting in lower cost per part and higher profit.
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Designed for fine-pitch ACF bonding applications (> 30 mircon), the ACF (Anisotropic Conductive Film) Laminator uses a two- or three-step process to connect materials like flex-foil to glass or flex-foil to PCB.
ACF Laminating/Pre-Bonding is achieved by dispensing and cutting the ACF tape, positioning it over the surface of the parts to be bonded, and moving the thermode into position. The flex is then moved into position to align the traces to the substrate, and the thermode is actuated to complete the bond.
The basic systems includes a constant heat power supply and pneumatic bonding head. Options include the addition of interposer tape, alignment, and product jig modules.
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