Thermodes for Benchtop and Integration Reflow Soldering & Bonding Heads

The three-dimensional (TD) family of thermodes are designed for use with the SA Series reflow soldering heads.

Utilized for a number of different hot bar reflow soldering and bonding applications including heat staking, the TD hot bar bonding thermodes feature:

  • Uniform temperature distribution across the thermode face
  • Retain optimal flatness under heating
  • Eliminate voltage potential, and have
  • Extremely fast heating and cooling to optimize process times