Hot Bar Bonding

Hot bar bonding is the generic term used to describe a number of processes including Hot Bar Reflow Soldering, Heat Staking, ACF Laminating, Heat Seal Bonding and ACF Bonding.

Hot Bar Bonding is achieved using a thermode or “Hot Bar” which is heated and cooled under pressure using either a pulsed heat or constant heat reflow soldering power supply, creating an electrical connection between the materials joined.

Hot bar bonding is commonly used to connect flex-foils to printed circuit boards, small wires, small coax cables and very light or small components.

Read the Reflow Soldering Process Overview and Part Design Guidelines for Reflow Soldering Flex to PCB’s

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